Low pressure molding is a refined version of conventional injection molding which uses lower pressure to gently encapsulate delicate electronics assemblies and protect them from harsh environments such as moisture, high temperatures, dust, and chemical exposure.
LPM protects your product from excess wear and tear, cable strain (if applicable), vibration, water & dust.
Low Pressure Injection Molding is also reduces manufacturing steps, part weight, cycle time, material consumption and total cost of ownership.
PCBs, plugs, connectors, cable bundles, control units, monitors, sensors and more.
LGS Overmold works with any and all industries. Our top industries include: Automotive, Defense, Aerospace, Industrial, Medical and Consumer Goods.
Linear GS works closely with you to determine your timeframe and budget. Every project is unique, but LGS Overmold strives to provide industry-leading turnaround times compared to our competition.
No, LGS Overmold can accommodate all project sizes, including volume production or just a simple prototype or pilot run.